(a) (c) (b) (e) (d) 1. part no. expression : (b) material code (c) impedance code (a) series code 2. conf igurat ion & di me ns ions : 4. mate ri als : superworld electronics (s) pte ltd (a) body : ferrite (b) termination : ag/ni/sn a 3. sche mati c : (d) r : reel (e) current code pg. 1 0.20 0.02 bd unit:m/m 0.40 0.02 ac 0.20 0.02 0.10+0.04/-0.03 b ag(100%) ni(100%)-1.5u m(min.) sn(100%)-3.0u m(min.) h l g (f) ferrite chip beads z a w 1 0 0 - r e - 5. ge ne ral sp ecif ication : a d b c 28.01.2015 note : specifications subject to change without notice. please check our website for latest information. za series l 0.5 ref. g 0.20 ref. h 0.15~0.30 pc board pattern a) operating temp. : -40 c to +125 c ( including self-temperature. rise ) b) storage condition (component in its packaging) i) temperature : -10 to 40 c ii) humidity : 60% (f) 10: standard 11 ~ 99 : internal control number
superworld electronics (s) pte ltd pg. 2 6. electrical characteristics : zaw100-re-10 10 5 100 0.10 540 frequency impedance part number ( ? ) ( hz ) test ( ma ) ( ? ) max. dc resistance rated current max. 28.01.2015 za series zaw700-rb-10 70 25% 100 0.37 280 zaw121-rb-10 120 25% 100 0.53 240 zah750-rb-10 75 25% 100 0.45 260 ZAH121-RB-10 120 25% 100 0.60 220 ferrite chip beads note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 3 7. characteristics curves : 28.01.2015 za series ferrite chip beads note : specifications subject to change without notice. please check our website for latest information. 1 10 100 1000 10000 fr e q u e n c y ( m h z ) 0 5 10 15 20 25 30 impedance(ohm) fc m0 40 2wf-1 00 t05 z r x zaw100-re-10 1 10 100 1000 10000 fr e q u e n c y ( m h z ) 0 40 80 120 160 200 i m p e d a nc e ( oh m ) fc m0 40 2wf-7 00 t02 z r x zaw700-rb-10 1 10 100 10 00 10000 fr e quen c y ( mh z ) 0 100 200 300 i m p e d a nc e ( o h m ) fc m0 40 2wf-1 21 t02 z r x zaw121-rb-10 1 10 100 1000 10000 fr e q u e n c y ( m h z ) 0 100 200 300 im p e d a nc e ( ohm ) fc m0 40 2h f-75 0t0 2 z r x zah750-rb-10 1 10 100 1000 10000 fr e q u e n c y ( m h z ) 0 100 200 300 400 im p e d a nc e ( ohm ) fcm0402hf-121t02 z r x ZAH121-RB-10
superworld electronics (s) pte ltd pg. 4 8. soldering and mounti ng : 8-1. recommended pc board pattern under mechanical stress as warping the board. the mechanical stress to prevent failure. products shall be positioned in the sideway direction against pc board should be designed so that products are not sufficient air soldering tools. 8-2.2 soldering iron : 8-2.1 lead free solder re-flow : wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot by the difference in coefficients of expansion between solder, chip and substrate. the terminations are suitable for all mildly activated rosin fluxes are preferred. the minimum amount of solder can lead to damage from the stresses caused recommended temperature profiles for re-flow soldering in figure 1. products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a) preheat circuit and products to 150 c. b) 350 c tip temperature for ferrite chip bead (max) c) never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. for iron soldering in figure 2. note : 8-2. soldering e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4-5 secs. d) 1.0mm tip diameter (max) preheating tp(260 c/40s max.) 60~180s 4 80s max. figure 1. re-flow soldering:3 times max temperature c 150 25 200 217 time(sec.) within4~5s g rad ual cooling o ve r 60s. figure 2. wave soldering:1 times max cooling 60~150s 20~40s s olde ring natu ral cooling temperature c 150 350 preheating soldering natural re-flow soldering temperatures below 240 degrees, there will be unwitting risk if use wave soldering is there will be some risk. note. 28.01.2015 za series 0.15~0.30 0.50 0.20 ferrite chip beads note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 5 28.01.2015 za series ferrite chip beads note : specifications subject to change without notice. please check our website for latest information. may cause the failure of mechanical or electrical performance. solder shall be used not to be exceed as shown in fig. 3. accordingly increasing the solder volume, the mechanical stress to product is also increased. exceeding solder volume figure 3 r ec ommendable upper limit t 8-3. solder volume minimum fillet height = soldering thickness + 25% product height
superworld electronics (s) pte ltd pg. 6 9-1. reel dimension 7" x 8mm 178.0 2.0 b(mm) 50 or more 10 1.5 a(mm) type 13.0 0.2 c(mm) d(mm) 9. packaging information : 2.0 0.05 p(mm) 0.25 0.04 bo(mm) 0.45 0.04 ko(mm) 0.36max ao(mm) t(mm) 0.36max material of taping is paper f:3.5 0.1 e:1.75 0.1 d:1.5 +0.1 -0 .0 9-2 tape dimension / 8mm 28.01.2015 za series d embossed carrier b a cover tape 2.0 0.5 ?c po : 4 0.1 pao bo w : 8.0 0.3 ko t ferrite chip beads note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 7 28.01.2015 za series 9-3. packaging quantity za 500000 100000 mi ddl e box chip / reel inner box series 20000 1000000 carton ferrite chip beads note : specifications subject to change without notice. please check our website for latest information. base tape 9-4. tearing off force top cover tape 165 c to 180 c f the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. teari ng speed room humidity room temp. ( c) 5~35 (%) 45~85 room atm 860~1060 (hpa) 300 (mm/min) a) recommended products should be used within 12 months from the time of delivery. b) the packaging material should be kept where no chlorine or sulfur exists in the air. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. to maintain the solderabililty of terminal electrodes : 1. storage conditions : application notice 2. transportation :
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